IC2 is pleased to announce the release of our new MHzPressure™ Sensor, a fully calibrated, high-speed, mean and fluctuating pressure sensor that enables wide-band performance for hypersonic flow measurement applications. Based on IC2's proven piezoelectric MEMS...
IC2 is pleased to announce the launch of DirectShear-2D™, a dual-axis wall shear stress sensor. DirectShear-2D is a derivative of the original capacitive DirectShear sensing system, an industry first direct wall shear stress floating element sensor. Building on the...
IC2 is exhibiting at Booth 313 in the AIAA SciTech 2023 expo hall at the Gaylord National Resort and Convention Center in National Harbor, Maryland. We would appreciate it if you were to visit us on Tuesday, Wednesday, or Thursday, January 24–26, 2023. We will be...
IC2 was recently awarded a Phase 2E SBIR contract to further the capabilities of their planned future product line under the project titled “Field Deployable Wireless Data Acquisition System for Ground-Test Arrays.” This Phase 2 Enhancement contract will enable IC2 to...
IC2 was recently awarded a NASA Phase 1 SBIR, titled “Advanced Phased Array Instrumentation and Processing for Engine Inlet Measurements,” to create novel phased-array instrumentation and processing for aircraft engine-inlet acoustic measurements. IC2 will partner...
IC2 is currently hiring for a full-time position as a MEMS Process Engineer. Please see below for information about the position and contact the hiring department at HR@thinkic2.com to apply. Location: Gainesville, FL MEMS Process Engineer Job Description ROLE AND...
IC2 recently began work on a NASA Phase 2 SBIR contract titled "Flat-Package MEMS Fuselage Microphones for External Airplane Fluctuating Pressure Field Measurements" to continue development on this new product line. During this Phase 2 contract, IC2 will be developing...
IC2 was recently awarded a NASA Phase 1 SBIR, titled “On-Board Low-Profile Skin Friction Sensor,” to enhance DirectShear wall shear stress sensors for use in flight-test environments. New sensor geometries, digitized electronics in the sensor head, and the addition of...