IC2 received US Patent #10,461,239 titled Microscale Sensor Structure with Backside Contacts and Packaging of the Same
IC2 Receives Patent for Sensor Backside Wire Bonding
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by Jared Anderson | Apr 14, 2020 | Announcements, Patents
IC2 received US Patent #10,461,239 titled Microscale Sensor Structure with Backside Contacts and Packaging of the Same
by Jared Anderson | Oct 16, 2018 | Announcements, Employee News
IC2 hires Philip Fournier as MEMS Fabrication Process Engineer. This expands our ability to produce MEMS sensors for aerodynamic and aeroacoustics applications.