IC2 received US Patent #10,461,239 titled Microscale Sensor Structure with Backside Contacts and Packaging of the Same
IC2 Receives Patent for Sensor Backside Wire Bonding
read more
Blog Categories
Recent News
Press Releases, Product Updates, and Company Announcements
IC2 Welcomes Philip Fournier as MEMS Fabrication Engineer
IC2 hires Philip Fournier as MEMS Fabrication Process Engineer. This expands our ability to produce MEMS sensors for aerodynamic and aeroacoustics applications.