IC2 received US Patent #10,461,239 titled Microscale Sensor Structure with Backside Contacts and Packaging of the Same
Press Releases, Product Updates, and Company Announcements
IC2 hires Philip Fournier as MEMS Fabrication Process Engineer. This expands our ability to produce MEMS sensors for aerodynamic and aeroacoustics applications.
Acoustic Acoustic Liners Calibration Conference DirectShear Dissertation Electronics Expo Fabrication Facilities Five-hole probe Flight Testing Flow Sensing Former Employees Guides High Temperature Insider Microphone Arrays Microphones New Hires Optical sensors Press Release Pressure Sensors Product Announcement Shear Stress Skin Friction Wind Tunnel