This paper presents the development and experimental characterization of the first truly flush-mount piezoelectric microelectromechanical systems (MEMS) dynamic pressure sensor with associated packaging for aircraft fuselage arrays. Through-silicon-vias (TSVs) are incorporated into the fabrication of the sensor to eliminate front-side wire bonds and enable an overall flush surface for the packaged sensor that minimizes flow disturbance. The developed packaging method for the sensor demonstrates an overall flushness to within 6 μm, showing substantial improvement from any previously reported efforts. Initial calibration of the sensor demonstrates a comparable sensitivity of 10.3 μV/Pa at 1 kHz, a noise floor of 44.6 dB SPL and significantly higher resonant frequency of 187 kHz than prior piezoelectric aeroacoustic microphones, indicating a large usable bandwidth.
