Services

IC2 uses a three-stage approach to MEMS device design: lumped-element modeling to capture the key physics, formal optimization to maximize performance within design/fabrication constraints, and multi-physics FEM/FEA for model verification. Using lumped-element modeling early in the process and saving FEM for verification enables rapid convergence on an optimal solution to meet targeted specifications.

IC2 begins all process flow development with a high-level overview, selecting a general approach and outlining the major fabrication steps and processes. Then we dive further into each process step, defining all steps and sub-steps in great detail. At this stage, we also nail down specific recipes and process parameters for particular fabrication equipment. Finally, we produce a formal process traveler that will accompany the wafers through the fabrication process, providing sufficient detail to direct a MEMS process engineer or fabrication technician through the full processing of your MEMS devices.

In order to fabricate MEMS devices, you will first need a set of photolithography masks, one for each layer to be patterned. Our comprehensive layout service will provide you with finalized layout files and physical masks in either soda-lime or quartz. We regularly work with major photolithography mask manufacturers and are intimately familiar with all the intricacies of the design and ordering process, ensuring that you get the desired end product.

IC2 has access to, and experience with, a wide range of microfabrication tools and services for 4″ (100mm) and 6″ (150mm) diameter wafers through its network of academic clean room facilies and commercial fabrication service providers. Our in-house MEMS process engineers are available to perform single processes up to full MEMS device fabrication with either IC2-designed or customer-provided photolithography masks.

IC2 is capable of providing R&D prototype and limited-run production services from single-wafer runs to larger multi-wafer lots. For high-volume production, we can help guide you in evaluating and selecting a commercial MEMS foundry that will meet your needs.

Even the best MEMS device will fall short of expectations without a package that enables it to operate at its peak.  With expertise in benign and harsh-environment MEMS packaging and low-noise analog signal conditioning electronics, IC2 provides mechanical and electrical packaging and assembly design services to ensure your device will perform at its best.

High-quality electrical connections are critical for high-performance MEMS devices. IC2 provides wire bonding services using a gold-wire ball bonder for bond pad pitches as low as 80μm.

IC2 provides MEMS die attachment services using its in-house flip chip bonding system, enabling high-accuracy alignment between the sensor and attachment substrate.  The heated stage and bond head provide the ability to perform die attachment using adhesives and/or solders.

From die-level testing through mechanical, electrical, and environmental testing of completed MEMS assemblies, IC2 offers a full suite of characterization tools to ensure your device meets or exceeds your application requirements. IC2 can also assist with achieving necessary product and safety certifications for the US and abroad.

Packaging, assembly, and testing of MEMS devices often comprises the majority of the production cost.  IC2 focuses on design for manufacturing in all of its mechanical and electrical components to minimize the cost of assembly while still maintaining high performance.