Device Packaging and Assembly

IC2 offers custom sensor packaging services for all of your sensor needs. With both back end processing tools and experience, IC2 is able to combine our die and electronics fabrication capacities to achieve full end-to-end production of sensor assemblies. Our in-house capabilities include flip chip bonding, wire bonding, and other highly skilled soldering abilities to ensure minimization of packaging parasitic properties.

IC2 regularly packages our DirectShear and other IC2 sensors and knows the quality and craftsmanship needed to create high-fidelity final products. IC2’s primary business is to build sensors for aerospace customers who rely on robust and reliable sensors and often require custom packaging to meet tight tolerances in their testing facilities. We bond your sensor die to a variety of substrates such as Pyrex, glass frit, and anodic bonding. These various bond techniques, coupled with our highly skilled techs, enable minimization of surface roughness, EMI injection, and other parasitic effects to create a high-performance sensor system.

Mechanical and Electrical Design

Even the best MEMS device will fall short of expectations without a package that enables it to operate at its peak. With expertise in benign and harsh-environment MEMS packaging and low-noise analog signal conditioning electronics, IC2 provides mechanical and electrical packaging design services to ensure your device will perform at its best.

Wire Bonding

High-quality electrical connections are critical for high-performance MEMS devices. IC2 provides wire bonding services using a gold-wire ball bonder for bond pad pitches as low as 80μm.

A K&S 4524D Digital Wire Bonder facilitates the connecting of die elements to chip circuitry. Comprehensive controllable bond settings make wiring between a variety of substrates possible. The availability of our in-house wire bonding tool allows our team to quickly assemble R&D prototypes, as well as manufacture small batches of commercial products.

Flip-Chip Bonding

IC2 provides die attachment services using its in-house flip chip bonding system, enabling high-accuracy alignment between the sensor and attachment substrate. The heated stage and bond head provide the ability to perform die attachment using adhesives and/or solders

Utilizing a SemiCorp Model 850 Flip Chip Placement System, substrate bonding with a nominal accuracy of +/- 12 microns can be achieved. The integration of a heated stage in this system allows for the use of a wide variety of adhesives. Our flip chip bonding capability enables our engineers to precisely align and bond substrates prior to subsequent downstream processing, such as wire bonding, housing, or other packaging steps.

Characterization

From die-level testing through mechanical, electrical, and environmental testing of completed MEMS assemblies, IC2 offers a full suite of characterization tools to ensure your device meets or exceeds your application requirements. IC2 can also assist with achieving necessary product and safety certifications for the US and abroad.

Design For Manufacturing

Packaging of MEMS devices often comprises the majority of the production cost. IC2 focuses on design for manufacturing in all of its mechanical and electrical components to minimize the cost of assembly while still maintaining high performance.