Specialized Assembly Staff
IC2 bonds your sensor die to a variety of substrates such as Pyrex, glass frit, and anodic bonding. These various bond techniques, coupled with our highly skilled techs, enable minimization of surface roughness, EMI injection, and other parasitic effects to create a high-performance sensor system.
TRUSTED SENSOR PACKAGING ENGINEERS
Our quality is trusted by leaders in the aerospace and defense industries and IC2’s experienced team of sensor packaging experts is ready to take on your project requirements.
With design for manufacturing at the heart of our engineering philosophy, IC2 strives to prepare our customers for transition from prototype to production.
IC2 regularly packages our own line of sensors and we know the quality and craftsmanship needed to create high-fidelity final products. Our engineers are experienced in wire & flip chip bonding methods such as gold, ball, and others.
Utilizing a SemiCorp Model 850 Flip Chip Placement System, substrate bonding with a nominal accuracy of +/- 12 microns can be achieved. The integration of a heated stage in this system allows for the use of a wide variety of adhesives. Our flip chip bonding capability enables our engineers to precisely align and bond substrates prior to subsequent downstream processing, such as wire bonding, housing, or other packaging steps.
A K&S 4524D Digital Wire Bonder facilitates the connecting of die elements to chip circuitry. Comprehensive controllable bond settings make wiring between a variety of substrates possible. IC2’s in-house wire bonding tool allows our team to quickly assemble R&D prototypes and manufacture small batches of commercial products.
Following alignment and bonding, the die are ready to be assembled in their housings. Housing and die assembly is often a challenging critical step in the fabrication of a product. IC2 is able to assist clients in the design and manufacture of robust housings and assembly protocols for these sensitive and delicate devices.
IC2 has extensive experience in silicon-based MEMS technology and fabrication utilizing our in-house techs and academic partner clean room facilities. Our specialized cost-effective solutions begin with designing, or implementing a customer provided, photolithography mask layout and fabrication process flow design.
IC2 strives to minimize the number of masks and steps in the process flow to maximize sensor yield and curtail the risks of fabrication errors in order to provide out customers with a cost-effective sensor fabrication solution.
IC2 offers custom sensor, transducer, and full instrumentation system design and optimization for precision measurements in all kinds of environments. We can design sensors using a wide array of transduction methods and materials to best suit your application.
Wire Bonding & Flip-Chip Bonding
IC2 regularly packages our own line of sensors and we know the quality and craftsmanship needed to create high-fidelity final products. Our engineers are experienced in wire & flip chip bonding methods such as gold, ball, and others.
Die Attach
IC2 bonds your sensor die to a variety of substrates such as Pyrex, glass frit, and anodic bonding. These various bond techniques, coupled with our highly skilled techs, enable minimization of surface roughness, EMI rejection, and other parasitic effects to create a high-performance sensor system.
Sensor Housing Design
Even the best MEMS device will fall short of expectations without a package that enables it to operate at its peak. With expertise in benign and harsh-environment MEMS packaging and low-noise analog signal conditioning el