Specialized Sensor Housing Designers
Robust wire & flip-chip bonding services for sensitive devices; with focus on process to minimize parasitic properties in your sensors.
QUALITY CRAFTSMANSHIP
Our quality is trusted by leaders in the aerospace and defense industries and IC2’s experienced team of sensor packaging experts is ready to take on your project requirements.
With design for manufacturing at the heart of our engineering philosophy, IC2 strives to prepare our customers for transition from prototype to production.
IC2 regularly packages our own line of sensors and we know the quality and craftsmanship needed to create high-fidelity final products. Leverage IC2’s 20+ years of MEMS design & build experience to maximize yield & performance
Utilizing a SemiCorp Model 850 Flip Chip Placement System, substrate bonding with a nominal accuracy of +/- 12 microns can be achieved. The integration of a heated stage in this system allows for the use of a wide variety of adhesives. Our flip chip bonding capability enables our engineers to precisely align and bond substrates prior to subsequent downstream processing, such as wire bonding, housing, or other packaging steps.
A K&S 4524D Digital Wire Bonder facilitates the connecting of die elements to chip circuitry. Comprehensive controllable bond settings make wiring between a variety of substrates possible. IC2’s in-house wire bonding tool allows our team to quickly assemble R&D prototypes and manufacture small batches of commercial products.
Following alignment and bonding, the die are ready to be assembled in their housings. Housing and die assembly is often a challenging critical step in the fabrication of a product. IC2 is able to assist clients in the design and manufacture of robust housings and assembly protocols for these sensitive and delicate devices.
Wire Bonding & Flip-Chip Bonding
IC2 regularly packages our own line of sensors and we know the quality and craftsmanship needed to create high-fidelity final products. Our engineers are experienced in wire & flip chip bonding methods such as gold, ball, and others.
Die Attach
IC2 bonds your sensor die to a variety of substrates such as Pyrex, glass frit, and anodic bonding. These various bond techniques, coupled with our highly skilled techs, enable minimization of surface roughness, EMI rejection, and other parasitic effects to create a high-performance sensor system.
Sensor Housing Design
Even the best MEMS device will fall short of expectations without a package that enables it to operate at its peak. With expertise in benign and harsh-environment MEMS packaging and low-noise analog signal conditioning electronics, IC2 provides mechanical and electrical packaging and assembly design services to ensure your device will perform at its best.