Specialized MEMS Manufacturing Consultants
From turnkey MEMS sensor prototyping to limited production-scale manufacturing, IC2 can fabricate and micromachine your custom sensor designs.
Trusted MEMS sensor development consulting services to advance your organization’s goals.
QUALITY CRAFTSMANSHIP
Our quality is trusted by leaders in the aerospace and defense industries and IC2’s experienced team of MEMS fabrication experts is ready to take on your project requirements.
With design for manufacturing at the heart of our engineering philosophy, IC2 strives to prepare our customers for transition from prototype to production.
SINGLE-STEP & FULL-SCALE SERVICES AVAILABLE
Our engineering and technical services team support you throughout the full custom MEMS device and electronics product development life cycle, from design and modeling, through fabrication, packaging, assembly, and testing. Whether you need expert support at just one stage or throughout, IC2 is ready to help you bring your product to market.
IC2 has extensive experience in silicon-based MEMS technology and fabrication utilizing our in-house techs and academic partner clean room facilities. Our specialized cost-effective solutions begin with designing, or implementing a customer provided, photolithography mask layout and fabrication process flow design.
IC2 strives to minimize the number of masks and steps in the process flow to maximize sensor yield and curtail the risks of fabrication errors in order to provide out customers with a cost-effective sensor fabrication solution.
IC2 offers custom sensor, transducer, and full instrumentation system design and optimization for precision measurements in all kinds of environments. We can design sensors using a wide array of transduction methods and materials to best suit your application.
Wire Bonding & Flip-Chip Bonding
IC2 regularly packages our own line of sensors and we know the quality and craftsmanship needed to create high-fidelity final products. Our engineers are experienced in wire & flip chip bonding methods such as gold, ball, and others.
Die Attach
IC2 bonds your sensor die to a variety of substrates such as Pyrex, glass frit, and anodic bonding. These various bond techniques, coupled with our highly skilled techs, enable minimization of surface roughness, EMI injection, and other parasitic effects to create a high-performance sensor system.
Sensor Housing Design
Even the best MEMS device will fall short of expectations without a package that enables it to operate at its peak. With expertise in benign and harsh-environment MEMS packaging and low-noise analog signal conditioning electronics, IC2 provides mechanical and electrical packaging and assembly design services to ensure your device will perform at its best.
